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tlp785,TLP785F 2012-02-20 1 1 2 3 4 1 : anode 2 : cathode 3 : emitter 4 : collector toshiba photocoupler gaas ired & photo ? transistor tlp785,TLP785F office equipment household appliances solid state relays switching power supplies various controllers signal transmission be tween different voltage circuits the toshiba tlp785 consists of a silicone phototransistor optically coupled to a gallium arsenide (gaas) infrared emitting diode in a four lead plastic dip (dip4) with having high isolation voltage (ac: 5kv rms (min)). TLP785F is a lead forming type for the long creepage surface mounting of tlp785. ? tlp785: 7.62mm pitch type dip4 ? TLP785F: 10.16mm pitch type dip4 ? collector-emitter voltage: 80v (min.) ? current transfer ratio: 50% (min.) rank gb: 100% (min.) ? isolation voltage: 5000v rms (min.) ? ul approved: ul1577, file no. e67349 ? bsi under application: bs en60065:2002 bs en60950-1:2006 ? semko under application:en60065:2002 en60950-1:2001, en60335-1:2002 ? option(d4)type vde approved: din en60747-5-2 (note): when an en60747-5-2 approved type is needed, please designate ?option (d4)? . ? construction mechanical rating 7.62mm pitch standard type 10.16mm pitch tlpxxxf type creepage distance 7.0mm(min) 8.0mm(min) clearance 7.0mm(min) 8.0mm(min) insulation thickness 0. 4mm(min) 0.4mm(min) inner creepage distance 4.0mm(min) 4.0mm(min) unit: mm toshiba 11-5l1 weight: 0.32 g (typ.) unit: mm toshiba 11-5l102 weight: 0.32g (typ.) tlp785 pin configurations (top view) TLP785F
tlp785,TLP785F 2012-02-20 2 current transfer ratio current transfer ratio (%) (i c / i f ) i f = 5ma, v ce = 5v, ta = 25c type classification (note 1) min max marking of classification none 50 600 blank rank y 50 150 ye rank gr 100 300 gr rank bl 200 600 bl rank gb 100 600 gb rank yh 75 150 y+ rank grl 100 200 g rank grh 150 300 g+ tlp785 rank bll 200 400 b (note 1): ex. rank gb: tlp785 (gb) (note 2): application type name fo r certification test, please use standard product type name, i. e. tlp785 (gb): tlp785 absolute maximum ratings (ta = 25c) characteristic symbol rating unit forward current i f 60 ma forward current derating (ta 39c) i f / c ? 0.7 ma / c pulse forward current (note 3) i fp 1 a power dissipation p d 90 mw power dissipation derating p d / c ? 0.9 mw / c reverse voltage v r 5 v led junction temperature t j 125 c collector ? emitter voltage v ceo 80 v emitter ?collector voltage v eco 7 v collector current i c 50 ma power dissipation (s ingle circuit) p c 150 mw power dissipation derating (ta 25c) p c / c ? 1.5 mw / c detector junction temperature t j 125 c operating temperature range t opr ? 55 to 110 c storage temperature range t stg ? 55 to 125 c lead soldering temperature (10s) t sol 260 c total package power dissipation p t 240 mw total package power dissipation derating (ta 25c) p t / c ? 2.4 mw / c isolation voltage (note 4) bv s 5000 v rms (note): using continuously under heavy loads (e.g. the application of high temperatur e/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operat ing temperature/current/voltage, etc. ) are within the absolute maximum ratings. please design the appropriate reliability upon reviewing the toshiba semiconductor reliability handbook (?handling precautions?/?derating concept and methods?) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). (note 3): 100 s pulse, 100 hz frequency (note 4): ac, 1 min., r.h. 60%. apply voltage to led pin and detector pin together.
tlp785,TLP785F 2012-02-20 3 recommended operating conditions (note) characteristic symbol min typ. max unit supply voltage v cc D 5 24 v forward current i f D 16 25 ma collector current i c D 1 10 ma operating temperature t opr 25 D 85 c (note): recommended operating conditions are given as a design guideline to obtain expected performance of the device. additionally, each item is an independent guideline respectively. in developing designs using this product, please confirm specified characteristics shown in this document. individual electrical char acteristics (ta = 25c) characteristic symbol test condition min typ. max unit forward voltage v f i f = 10 ma 1.0 1.15 1.3 v reverse current i r v r = 5 v D D 10 a led capacitance c t v = 0v, f = 1 mhz D 30 D pf collector emitter breakdown voltage v (br) ceo i c = 0.5 ma 80 D D v emitter collector breakdown voltage v (br) eco i e = 0.1 ma 7 D D v v ce = 24 v D 0.01 0.1 a collector dark current i d (i ceo ) v ce = 24 v ,ta = 85c D 0.6 50 a detector capacitance (collector to emitter) c ce v = 0v, f = 1 mhz D 6 D pf coupled electrical characteristics (ta = 25c) characteristic symbol test condition min typ. max unit 50 D 600 current transfer ratio i c / i f i f = 5 ma, v ce = 5 v rank gb 100 D 600 % D 60 D saturated ctr i c / i f (sat) if = 1 ma, v ce = 0.4 v rank gb 30 D D % i c = 2.4 ma, i f = 8 ma D D 0.4 D 0.2 D collector emitter saturation voltage v ce (sat) i c = 0.2 ma, i f = 1 ma rank gb D D 0.4 v isolation characteristics (ta = 25c) characteristic symbol test condition min typ. max unit capacitance (input to output) c s v s = 0v, f = 1 mhz D 0.8 D pf isolation resistance r s v s = 500 v 110 12 10 14 D ac, 1 minute 5000 D D ac, 1 second, in oil D 10000 D v rms isolation voltage bv s dc, 1 minute, in oil D 10000 D vdc
tlp785,TLP785F 2012-02-20 4 switching characteristics (ta = 25c) characteristics symbol test condition min typ. max unit rise time t r D 2 D fall time t f D 3 D turn ? on time t on D 3 D turn ? off time t off v cc = 10 v, i c = 2 ma r l = 100 ? D 3 D s turn ? on time t on D 1.5 D storage time t s D 25 D turn ? off time t off r l = 1.9 k ? (fig. 1) v cc = 5 v, i f = 16 ma D 50 D s surface-mount lead form option toshiba 11-5l106 weight: 0.31g (typ.) toshiba 11-5l107 weight: 0.31g (typ.) unit: mm tlp785(lf6) TLP785F(lf7) unit: mm i f v ce v cc t on 4.5v 0.5v t off t s v cc v ce i f r l (fig. 1): switching time test circuit
tlp785,TLP785F 2012-02-20 5 option: specifications for embossed-tape packing; (tp6)/(tp7) 1. applicable package package name product type dip4lf6 tlp785 dip4lf7 TLP785F 2. product naming system type of package used for shipment is denoted by a symbol suffix after a product number. the method of classification is as below. (example) tlp785 (bl ? tp6,f [[g]]/rohs compatible tape type ctr rank device name (example2) TLP785F (bl ? tp7,f [[g]]/rohs compatible tape type ctr rank device name 3. tape dimensions 3.1 orientation of device in relation to direction of tape movement device orientation in the recesses is as shown in figure 2. figure2 device orientation 3.2 tape packing quantity:2000 devices per reel 3.3 empty device recesses are as shown in table 1. table1 empty device recesses standard remarks occurrences of 2 or more successive empty device recesses 0 within any given 40-mm section of tape, not including leader and trailer single empty device recesses 6 devices (max.) per reel not including leader and trailer 3.4 start and end of tape the start of the tape has 30 or more empty holes. the end of the tape has 50 or more empty holes. tape feed p 1pin indication
tlp785,TLP785F 2012-02-20 6 3.5 tape specification [1] tlp785(tp6) / TLP785F(tp7) (1)tape material: plastic (2)dimensions: the tape dimensions are as shown in figure 3. figure 3 tape forms tp6 type tp7type a 5.10.1 5.050.1 b 10.60.1 12.350.1 w 16.00.3 24.00.3 f 7.50.1 11.50.1 t 4.20.15 4.40.1 w f a t b 1.5min w f a t b 1.5min unit: mm
tlp785,TLP785F 2012-02-20 7 3.6 reel specification [1] tlp785(tp6) / TLP785F(tp7) (1)material: plastic (2)dimensions: the reel dimensions are as shown in figure 4. figure 4 reel forms 4. packing two reels of photocouplers are packed in a shipping carton. 5. label indication the carton bears a label indicating the product number, t he symbol representing classification of standard, the quantity, the lot number and the toshiba company name. 6. ordering information when placing an order, please specify the product number , the ctr rank, the tape type and the quantity as shown in the following example. (example) tlp785(bl ? tp6,f 4000pcs. quantity (must be a multiple of 4000) [[g]]/rohs compatible tape type ctr rank device name (note): the order code may be suffixed with a letter or a digit. please contact your nearest toshiba sales representative for more details. w1 w2 330 max 1001.5 13.00.5 4.00.5 2.00.5 unit: mm tp6 type tp7 type w1 16.5 24.4typ w2 23max 30.4max
tlp785,TLP785F 2012-02-20 8 soldering and storage 1. soldering 1.1 soldering when using a soldering iron or medium infrared ray/ho t air reflow, avoid a rise in device temperature as much as possible by observing the following conditions. 1) using solder reflow temperature profile example of lead (pb) solders temperature profile example of using lead (pb)-free solders 2) using solder flow (for lead (pb) solder, or lead (pb)-free solder) please preheat it at 150c between 60 and 120 seconds. complete soldering within 10 seconds below 260c. each pin may be heated at most once. 3) using a soldering iron complete soldering within 10 seconds below 260c, or within 3 seconds at 350c. each pin may be heated at most once. time (s) (c) 240 210 160 60 to 120s less than 30s package surface temperature 140 time (s) (c) 260 230 190 60 to 120s 30 to 50s 180 package surface temperature this profile is based on the devices maximum heat resistance guaranteed value. set the preheat temperature/heating temperature to the optimum temperature corresponding to the solder paste type used by the customer within the described profile. this profile is based on the devices maximum heat resistance guaranteed value. set the preheat temperature/heating temperature to the optimum temperature corresponding to the solder paste type used by the customer within the described profile.
tlp785,TLP785F 2012-02-20 9 2. storage 1) avoid storage locations where devices may be exposed to moisture or direct sunlight. 2) follow the precautions printed on the packing label of the device for transportation and storage. 3) keep the storage location temperature and humidity within a range of 5c to 35c and 45% to 75%, respectively. 4) do not store the products in locations with poiso nous gases (especially corrosive gases) or in dusty conditions. 5) store the products in locations with minimal temperature fluctuations. rapi d temperature changes during storage can cause condensation, resu lting in lead oxidation or corrosion, which will deteriorate the solderability of the leads. 6) when restoring devices after removal from their packing, use an ti-static containers. 7) do not allow loads to be applied direct ly to devices while they are in storage. 8) if devices have been stored for more than two year s under normal storage conditions, it is recommended that you check the leads for ease of soldering prior to use.
tlp785,TLP785F 2012-02-20 10 en60747-5-2 ?option: (d4)? attachment: specification for en60747-5-2 option: (d4) types: tlp785, TLP785F type designations for ?option: (d4) ?, which are tested under en60747 requirements. ex.: tlp785(d4-gr-lf6,f d4: en60747 option gr: ctr rank name lf6: standard lead bend name f: [[g]]/rohs compatible note: use toshiba standard type number for safety standard application. ex. tlp785(d4-gr-lf6,f ? tlp785 en60747 isolation characteristics description symbol rating unit application classification for rated mains voltage 300 v rms for rated mains voltage 600 v rms iiv iiii D climatic classification 55 / 115 / 21 D pollution degree 2 D tlp785 890 maximum operating insulation voltage TLP785F v iorm 1140 vpk tlp785 1335 input to output test voltage, vpr = 1.5v iorm , type and sample test t p = 10s, partial discharge < 5pc TLP785F v pr 1710 vpk tlp785 1670 input to output test voltage, vpr = 1.875v iorm , 100% production test t p = 1s, partial discharge < 5pc TLP785F v pr 2140 vpk highest permissible overvoltage (transient overvoltage, t pr = 60s) v tr 8000 vpk safety limiting values (max. permi ssible ratings in case of fault) current (input current) p si = 0 w power (output or total power dissipation) temperature i si p si t si 400 700 175 ma mw c insulation resistance, v io = 500v,ta=25c rsi ?10 12
tlp785,TLP785F 2012-02-20 11 insulation related specifications 7.62mm pitch tlpxxx type 10.16mm pitch tlpxxxf type minimum creepage distance cr 7.0mm 8.0mm minimum clearance cl 7.0mm 8.0mm minimum insulation thickness ti 0.4 mm comparative tracking index cti 175 (1) if a printed circuit is incorporated, the creepa ge distance and clearance may be reduced below this value. (e.g.at a standard distance between soldering ey e centres of 7.5mm). if this is not permissible, the user shall take suitable measures. (2) this photocoupler is suitable for ?safe electric al isolation? only within the safety limit data. maintenance of the safety data shall be ensured by means of protective circuits. vde test sign: marking on product for en60747 marking on packing for en60747 marking example: tlp785, TLP785F p 4 ctr rank marking lot no . device name 4: mark for option (d4) 1pin indication
tlp785,TLP785F 2012-02-20 12 figure 1 partial discharge measurement procedure according to en60747 destructive test for qualification and sampling tests. method a (for type and sampling tests, destructive tests) t 1 , t 2 t 3 , t 4 t p (measuring time for partial discharge) t b t ini v v initial (8kv) v pr (1335v for tlp785) (1710v for TLP785F) v iorm (890v for tlp785) (1140v for TLP785F) 0 t 1 t ini t 3 t 2 t p t b t 4 t = 1 to 10 s = 1 s = 10 s = 12 s = 60 s t p v pr (1670v for tlp785) (2140v for TLP785F) v iorm (890v for tlp785) (1140v for TLP785F) v t t 3 t 4 t b figure 2 partial discharge measurement procedure according to en60747 non-destructive test for100% inspection. method b (for sample test,non- destructive test) t 3 , t 4 t p (measuring time for partial discharge) t b = 0.1 s = 1 s = 1.2 s figure 3 dependency of maximum safety ratings on ambient temperature 500 400 300 200 100 0 0 25 50 75 100 125 150 175 1000 800 600 400 200 0 ta (c) psi ? ? isi isi (ma) psi ( mw )
tlp785,TLP785F 2012-02-20 13 i f -ta p c -ta forward current i f (ma) 0 20 40 60 80 100 -20 0 20 40 60 80 100 120 collector power dissipation p c (mw) 0 40 80 120 160 200 -20 0 20 40 60 80 100 120 ambient temperature ta ( ? c) ambient temperature ta ( ? c) ? v f / ? ta - i f i f -v f forward voltage temperature coefficient <1vf/<1 ta (mv/c) -3 -2.6 -2.2 -1.8 -1.4 -1 -0.6 0.1 1 10 100 forward current i f (ma) 0.1 1 10 100 0.4 0.9 1.4 1.9 forward current i f (ma) forward voltage v f (v) i fp ? v fp pulse forward current i fp (ma) 1 10 100 1000 0 0.4 0.8 1.2 1.6 2 2.4 pulse forward voltage v fp (v) *the above graphs show typical characteristic. pulse width 10 s repetitive frequency=100hz ta =25 c this curve shows the maximum limit to the forward current. this curve shows the maximum limit to the collector power dissipation. ta =25 ? c
tlp785,TLP785F 2012-02-20 14 iceo-ta i c -v ce collector dark current id (ma) 0.0001 0.001 0.01 0.1 1 10 0 20406080100 collector current i c (ma) 0 20 40 60 80 0246810 ambient temperature ta (c) collector-emitter voltage v ce (v) i c -v ce i c -i f collector current i c (ma) 0 10 20 30 40 0 0.2 0.4 0.6 0.8 1 1.2 collector current i c (ma) collector-emitter voltage v ce (v) 0.01 0.1 1 10 100 0.1 1 10 100 i c/ i f -i f collector-emitter voltage v ce (v) current transfer ratio i c / i f (%) 1 10 100 1000 0.1 1 10 100 forward current i f (ma) *the above graphs show typical characteristic. 5 10 50 30 20 15 ta =25 ? c i f =2ma v ce =5v v ce =0.4v ta =25 ? c ta =25 ? c 5 10 50 30 20 15 i f =2ma v ce =5v v ce =0.4v ta =25 ? c v ce =24v
tlp785,TLP785F 2012-02-20 15 i c - ta v ce(sat) - ta collector current i c (ma) 0.1 1 10 100 -40-20 0 20406080100 collecto r -emitter saturation voltage v ce(sat) (v) 0 0.04 0.08 0.12 0.16 0.2 -40 -20 0 20 40 60 80 100 ambient temperature ta (c) ambient temperature ta (c) switching time - r l switching time ( s) 1 10 100 1000 1 10 100 load resistance r l (k ? ) *the above graphs show typical characteristic. i f =5ma, i c =1ma i f =0.5m a 5 1 10 20 t off ta =25 ? c i f =16ma v cc =5v t s t on v ce =5v
tlp785,TLP785F 2012-02-20 16 restrictions on product use ? toshiba corporation, and its subsidiaries and affiliates (collect ively ?toshiba?), reserve the right to make changes to the in formation in this document, and related hardware, software a nd systems (collectively ?product?) without notice. ? this document and any information herein may not be reproduc ed without prior written permission from toshiba. even with toshiba?s written permission, reproduc tion is permissible only if reproducti on is without alteration/omission. ? though toshiba works continually to improve product?s quality and reliability, product can malfunction or fail. customers are responsible for complying with safety standards and for prov iding adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a ma lfunction or failure of product could cause loss of human life, b odily injury or damage to property, including data loss or corruption. before customers use the product, create designs including the product, or incorporate the product into their own applications, cu stomers must also refer to and comply with (a) the latest versions of all relevant toshiba information, including without limitation, this document, the specifications, the data sheets and application notes for product and the precautions and condi tions set forth in the ?toshiba semiconductor reliability handbook? and (b) the instructions for the application with which the product will be us ed with or for. customers are solely responsible for all aspe cts of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this product in such design or applications; (b) eval uating and determining the applicability of any info rmation contained in this document, or in c harts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operatin g parameters for such designs and applications. toshiba assumes no liability for customers? product design or applications. ? product is intended for use in general el ectronics applications (e.g., computers, personal equipment, office equipment, measur ing equipment, industrial robots and home electroni cs appliances) or for specif ic applications as expre ssly stated in this document . product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality a nd/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or se rious public impact (?unintended use?). unintended use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic s ignaling equipment, equipment used to control combustions or explosions, safety dev ices, elevators and escalato rs, devices related to el ectric power, and equipment used in finance-related fields. do not use product for unintended use unless specifically permitted in thi s document. ? do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy product, whether in whole or in part. ? product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. ? the information contained herein is pres ented only as guidance for product use. no re sponsibility is assumed by toshiba for an y infringement of patents or any other intellectual property rights of third parties that may result from the use of product. no license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. ? a bsent a written signed agreement, except as provid ed in the relevant terms and conditions of sale for product, and to the maximum extent allowable by law, toshiba (1) assumes no liability whatsoever, including without limitation, indirect, co nsequential, special, or incidental damages or loss, including without limitation, loss of profit s, loss of opportunities, business interruption and loss of data, and (2) disclaims any and all express or implied warranties and conditions related to sale, use of product, or information, including warranties or conditions of merchantability, fitness for a particular purpose, accuracy of information, or noninfringement. ? gaas (gallium arsenide) is used in product. gaas is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose gaas in product. ? do not use or otherwise make available product or related so ftware or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or m anufacturing of nuclear, chemical , or biological weapons or missi le technology products (mass destruction w eapons). product and related software and technology may be controlled under the japanese foreign exchange and foreign trade law and the u.s. expor t administration regulations. ex port and re-export of product or related software or technology are strictly prohibited exc ept in compliance with all applicable export laws and regulations. ? please contact your toshiba sales representative for details as to environmental matters such as the rohs compatibility of pro duct. please use product in compliance with all applicable laws and regula tions that regulate the inclusion or use of controlled subs tances, including without limitation, the eu rohs directive. toshiba assumes no liability for damages or losses occurring as a result o f noncompliance with applicable laws and regulations.

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